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Πρόσθετα
χαρακτηριστικά |
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
Intel® C622 chipset
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
Expansion slots: 1 PCIe 3.0 x16 (x16 || x8), 1 PCIe 3.0 x8 (x0 || x8), 1 PCIe 3.0 x8, 1 PCIe 3.0 x4 (in x8)
2x Port NVMe PCIe 3.0 x4 via OCuLink
M.2 NGFF connector M.2 Interface: PCIe 3.0 x4 and SATA Form Factor: 2280 Key: M-Key
8 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10
2 10GbE LAN ports
10 SATA3 (6Gbps) via C622
5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)
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